National Science Foundation and Semiconductor Research Corporation (SRC) funded Dr. Sheldon Tan's research on reliability-aware dynamic thermal management for multi-core and 3D microprocessors.

The project, which is titled Thermal-Sensitive System-Level Reliability Analysis and Management for Multi-Core and 3D Microprocessors (NSF-1255899), will focus on the emerging thermal and thermal induced reliability issues in the multi/many core and 3D stacked microprocessors. The project was jointly funded by NSF and SRC