The research work for performing full-chip power and thermal map estimation for commercial multi-core microprocessor under realistic heat sink cooling has been accepted by IEEE Transaction on TCAD, the top journal in the EDA field. This work, leaded by Ph.D. student, Jinwei Zhang, is the first work to accurate estimate the full-chip power and thermal maps for real commercial microprocessor for the first time. It beats the stat of the art method by 100X speedup with much more accurate results. It represents a significant breakthrough for full-chip thermal and power estimation techniques and has broad applications. 

J. Zhang, S. Sadiqbatcha,  M. O’Dea, H. Amrouch and S. X.-D. Tan, “Full-chip power density and thermal map characterization for commercial micrprocessors under heat sink cooking”,  IEEE Transaction on Computer-Aided Design of Integrated Circuits and Systems (TCAD),  accepted.