Breadcrumb

Latest News

Prof. Sheldon Tan visited the State-Key Lab of ASIC and Systems at Fudan Univ. Shanghai, China

Prof. Sheldon Tan visited the State-Key Lab of ASIC and Systems at Fudan Univ. Shanghai, China. He also presented an invited talk titled Statistical Analysis of Full-Chip Leakage Power in Nanometer VLSI Systems.

Ph.D. Student Duo Li accepted an offer from Synopysis IC Compiler group as a Sr. R & D Engineer in July 2010

h.D. Student Duo Li accepted an offer from Synopysis IC Compiler group as a Sr. R & D Engineer in July 2010. Synopysis is a leading electronic design automation and solution company in the world. We wish Duo best and more successes in his future endeavor.

M.S. student, Thom Eguia successfully defended his M.S. thesis titled Package-level Thermal Behavioral Modeling for Multi-Core Microprocessors

M.S. student, Thom Eguia successfully defended his M.S. thesis titled "Package-level Thermal Behavioral Modeling for Multi-Core Microprocessors". Congratulation on Thom. We wish Thom best and more success in his future career.

Dr. Boyuan Yan's paper title Passive rational interpolation based reduction via Caratheodory extension for general systems has been accepted by IEEE Transaction on Circuit and System II(TCAS-II)

Dr. Boyuan Yan's paper title Passive rational interpolation based reduction via Caratheodory extension for general systems has been accepted by IEEE Transaction on Circuit and System II(TCAS-II). Boyuan is now working as a post-doc at Texas A&M University.

Prof. Sheldon Tan presented an invited talk titled Architecture-level Thermal Modeling and Simulation for Multi-Core Chip Design

Prof. Sheldon Tan presented an invited talk titled Architecture-level Thermal Modeling and Simulation for Multi-Core Chip Design in 2nd Nanoelectronics and Advanced Design Seminar at INAOE (Institute National Astrophysics, Optical and Electrics) at Puebla, Mexico.