Visiting Ph.D. student, Liang Chen's work on new semi-analytic solution for combined electromigration and thermomigration for general multi-segment interconnect wires has been accepted by IEEE Transaction on Computer-Aided Design. This work show the thermomigration can plays a significant roles on EM-failure and we developed a new approach to consider the Joule heating induced temperature spatial...

Prof. Sheldon Tan received a three-year $500K award (CCF-2007135) from National Science Foundation for exploring data-driven and deep learning based approaches to addressing the VLSI reliability and robust chip design. Recently machine learning, especially deep learning is gaining much attention due to the breakthrough performance in various cognitive applications. Machine learning for electronic design automation...

VSCLAB released the EMspice -- coupled EM-IR drop analysis tool for full-chip EM and IR check and sign-off. This is first tool to perform the full-chip EM-IR drop co-simulation to assess the EM-induced IR drop at specific targeted lifetime. The research work, leaded by Ph.D. student Zeyu Sun, has been published recently in IEEE Transaction...