Visiting Ph.D. student, Liang Chen's work on new semi-analytic solution for combined electromigration and thermomigration for general multi-segment interconnect wires has been accepted by IEEE Transaction on Computer-Aided Design.  This work show the thermomigration can plays a significant roles on EM-failure and we developed a new approach to consider the Joule heating induced temperature spatial temperature impacts. This is Liang's second transaction papers from his work at UCR. Congratulation on Liang!

L. Chen, S. X.-D. Tan, Z. Sun, S. Peng, M. Tang, J. Mao, “A fast semi-analytic approach for combined electromigration and thermomigration analysis for general multi-segment interconnects”, IEEE Transaction on Computer-Aided Design of Integrated Circuits and Systems (TCAD),  (accepted)